주식회사 씨티에스


Parts Feeder, Taping Machine, LED Machine

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CUSTOMER CENTER
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032) 327-3223
070-7777-3250
FAX : 032) 327-0048
AINA Wafer 세척 Chemical


▪Product Overview



Product name : DICING LIQUID

Product Series : DL

Product Model : -


DL - A300

Chip cutting protective liquid of low foam version


DL - A600

Chip cutting protective liquid of high foam version

 



▪Product Use



 




▪Product Characteristics



High cost performance, high concentration, high dilution ratio

Environmentally friendly, no harmful substances, no pollutant discharge,

Low COD/BOD, consistent with general sewege regulations

Slightly alkaline



*Product physical characteristics


Colour Colorless or yellow
Viscosity(cp, 25°C) 25 ~ 300
Specific Gravity(25°C) 1.0 - 1.1
pH 7.5 - 9.0
Boiling point 100°C
Water solubility Complete Dissolution
Recommended dilution ratio1 : 3000/6000/......


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