AINA Wafer 세척 Chemical 1 페이지 | 주식회사 씨티에스

주식회사 씨티에스

Parts Feeder, Taping Machine, LED Machine

CUSTOMER CENTER: 고객의 소리에 항상 귀기울이겠습니다; 032) 327-3223
070-7777-3250; FAX : 032) 327-0048; scsung@cts21.co.kr

AINA Wafer 세척 Chemical

> 제품소개 > AINA Wafer 세척 Chemical

▪Product Overview

▪Product name : DICING LIQUID

▪Product Series : DL

▪Product Model : -

DL - A300

Chip cutting protective liquid of low foam version

DL - A600

Chip cutting protective liquid of high foam version

▪Product Use

▪Product Characteristics

▪High cost performance, high concentration, high dilution ratio

▪Environmentally friendly, no harmful substances, no pollutant discharge,

Low COD/BOD, consistent with general sewege regulations

▪Slightly alkaline

*Product physical characteristics

▪Product Overview

▪Product name : MASK LIQUID

▪Product Series : CL

▪Product Model : -

For general LOW-K Wafer & Bumping Wafer

CL - HV

The improved CL Model makes the

laser beam penetration better, viscosity higher

and has the characteristics of preventing

metalion pollution

▪Product Use

▪Product Characteristics

▪Product physical characteristics

▪Product comparison

Product advantages	CL	CL-HV Special additives Secret	D Corp 003
Corrosion resistance	○	○	△
Prevent ion erosion	○	○	-
Laser penetration	○	◎	△
Coverage and protection performance	○	○	△

▪The R&D and Manufacture in Japan

▪The R&D Equipment